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NEACH Payments Group Appoints Alex Campbell to Board of Directors

NEACH Payments Group Appoints Alex Campbell to Board of Directors

NEACH Payments Group (NPG) announced the appointment of Alex Campbell to its Board of Directors. Campbell brings more than 27 years of experience in financial technology, payments operations, and client services, with deep expertise across treasury services, instant payments, and platform integration.

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Campbell currently serves as First Vice President, Chief Payments Officer at COCC, where he leads the company’s payment initiatives across product management, implementation, and client support teams. His experience spans ACH, wire, check processing, RTP, FedNow, and API‑driven payment platforms, along with strategic partnerships and enterprise‑level client initiatives while supporting organizations across the payments ecosystem.

“Alex brings a strong operational perspective and a deep understanding of both established and emerging payment rails,” said Sean Carter, AAP, APRP, NCP, President and CEO of NEACH Payments Group. “His experience will be a valuable asset to the Board as NPG continues to support organizations navigating an increasingly complex and dynamic payments environment.”

As a member of the Board, Campbell will support NPG’s strategic direction and governance as the organization advances a secure, resilient, and forward-looking payments ecosystem.

“I’m honored to join the NPG Board and contribute to an organization that plays a vital role in strengthening trust, compliance, and operational excellence across the payments industry,” said Campbell.

In addition to his professional background, Campbell brings governance experience from his past roles as Board Chair and Board Member of The Scribes Institute, Inc., and as Chair of the School Governance Committee (SGC) for Global Communication Academy. Campbell currently serves as a member of the University High School of Science & Engineering SGC He holds a Bachelor of Arts in Business from Southern New Hampshire University and an Associate of Science in Electronic Engineering and Technology from the University of Hartford.

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