Leading payment processor and banking-as-a-service provider enable credit access through personalized credit solutions
i2c Inc., a leading provider of digital payment and banking technology, announced its partnership with Bond Financial Technologies Inc., the leading embedded finance platform, to offer easier credit access to Americans through the Credit Builder Card and Bond Credit.
“With our credit products being backed by i2c’s agile processing platform, companies can now launch credit programs with Bond quickly and seamlessly.”
According to Experian, nearly one-third of U.S. consumers have a subprime credit score, and 49 million U.S. consumers are presently classified as either “credit invisible” or “unscorable.” Powered by i2c’s agile SaaS platform, Bond Credit Builder Card allows businesses to offer a secured credit building program for their customers in a matter of weeks, not months, with approved customers being able to use their card wherever Mastercard or Visa are accepted. With consistent on-time payments, Bond-secured Credit Builder Card users will be able to increase their credit scores over time.
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i2c also processes payments for the Bond Credit solution, in which customers leverage Bond’s easy-to-use APIs and Sandbox to create personalized credit products that can help their users manage expenses, scale business, offer rewards, and tailor repayment schedules. If approved, customers have immediate access to a virtual credit card.
“We are proud to partner with Bond as they work to reimagine credit in new and innovative ways utilizing banking-as-a-service and embedded finance,” said Ava Kelly, Chief Product Officer of i2c Inc. “With our highly-configurable platform, Bond gains the ability to self-service programs for their clients, to easily and rapidly launch a wide-range of use cases.”
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“Bond was built to give brands and banks the ability to scale safely so that they can provide exceptional customer experiences to all,” said Roy Ng, Co-founder and CEO of Bond. “With our credit products being backed by i2c’s agile processing platform, companies can now launch credit programs with Bond quickly and seamlessly.”
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