NextFlex Announces $6.5 Million in Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
Projects include developments of additive approaches for complex multilayer 3D electronics, high and low temperature interconnects with proven reliability and in-mold electronics for automotive applications NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, today announced $6.49M in funding (including $3.29M in cost-share contribution from participants) for seven new projects......